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プリント基板技術が進歩し、電子製品が小型化するにつれて、ご利用しているプリント基板サプライヤが、より高性能プリ ント基板設計の特殊な技術に必要な適切な設備を備えていることを確認する必要があります。
高性能プリント基板 板材
FR-4 基板
アルミ基板
銅ベース
基板
ロジャース基板
HDI基板
(非貫通スルーホール)
無電解金フラッシュ(ENIG)
電解金メッキ
ENEPIG
水溶性フラックス(OSP)
無電解銀メッキ
有鉛はんだ/無鉛はんだ
表面処理
端面スルーホール
特性インピーダンス制御
IVH / BVH(非貫通スルーホール)
樹脂埋め
皿穴 / 座ぐり穴
「z」字スリット
層構成指定
ハロゲンフリー
追加オプション
弊社のFR-4基板製造基準をご参照ください↓
層数
Standard
MC PCB
HDI interconnect
Rogers
1-14
1-2
4-14
1-14
板材
FR4
High TG
Halogen Free
High Frequency
Yes
TG - 170
Yes
Yes
最大寸法
"1 layer & 2 layers: 1200 × 300mm or 600 × 500mm
Multi-layers: 600 × 500mm"
板厚
"1 Layer/2 Layers: 0.2~2.4mm
4 Layers: 0.4~2.4mm
6 Layers: 0.8~2.4mm
8 Layers: 1.0~2.4mm
10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stack up are acceptable."
最小パターン幅
3mils
最小パターン間隔
3mils
外層銅箔厚
"1oz/2oz/3oz (35μm/70μm/105μm)

Note:
2oz
PCB thickness≥1.2mm,
Via size≥0.25mm,
Min Track/Spacing≥0.15mm

3oz
PCB thickness≥2.0mm,
Via size≥0.3mm,
Min Track/Spacing≥0.2mm"
内層銅箔厚
"1oz/1.5oz (35μm/50μm)"
最小ルーター加工穴径
0.15mm
Yes
最小レーザー加工穴径
0.1mm
Yes
Max aspect ratio
12 : 1
レジスト色
緑/赤/黄色/青/白/紫/黒/黒(ツヤ消し)/緑(ツヤ消し)/ なし
Yes
Plug via hold
Min aperture plugged
Max aperture plugged
Yes
Min annular ring
3mil
面付け
Vカット, スリット,
ミシン目
Yes
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